Process for making single-in-line integrated electronic component
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United States of America Patent
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Dec 8, 1987
Issued Date -
N/A
app pub date -
Dec 15, 1986
filing date -
Feb 17, 1984
priority date (Note) -
Expired
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Abstract
Method for making an insulating package premolded on a metallic frame with electrical contacts containing in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.
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