Assembly for packaging microcircuits having gold plated grounding and insulating leads, and method
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United States of America Patent
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Nov 17, 1987
Grant Date -
N/A
app pub date -
Sep 3, 1985
filing date -
Sep 3, 1985
priority date (Note) -
Expired
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Abstract
A plated metal assembly used for packaging hybrid microcircuits features both insulated and grounding leads plated with successive layers of nickel and gold, the leads attached to a metal header which is plated only with nickel. A method for mass producing the assembly includes pre-plating the grounding leads, and brazing them to the header after the header and insulated leads have been assembled and plated.
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