Injection moldable amide-imide copolymers containing polyetherimides
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United States of America Patent
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Nov 10, 1987
Issued Date -
N/A
app pub date -
Jul 3, 1986
filing date -
Jan 31, 1984
priority date (Note) -
Expired
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Abstract
The toughness properties of a polyamide-imide copolymer are improved by the addition of polyetherimides. These copolymers are useful as engineering resins, films are molded objects.
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