Application of polymeric materials to substrates
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United States of America Patent
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Nov 10, 1987
Issued Date -
N/A
app pub date -
Dec 11, 1985
filing date -
Jul 10, 1980
priority date (Note) -
Expired
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Abstract
The invention relates to a method of applying polymeric materials to the surface of a substrate by providing a layer of polymeric material on a release sheet and then subsequently transferring the polymeric material from the release sheet by the application of heat and pressure sufficient to effect adhesion of the polymeric material to the substrate and thereafter peeling the release sheet from the polymeric material. The invention is particularly concerned with the application of polymeric materials being capable of a secondary reaction at the time of application to the substrate or subsequent thereto.
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