Plating device for minute portions of connector terminals

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4702811
SERIAL NO

06924653

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This invention relates to an electro-plating device which is suitable for plating minute portions on protruding tip ends of a connector terminal. This invention device uses a plating solution supplying member in the form of a thin box which is erected upon a plating solution supplying box and which has a thickness small enough to be inserted between opposing plating areas. The plating areas are a pair of protruding tip ends of the connector terminal which move in contact with or near the supplying member. The plating solution supplying member comprises a combination of a supporting member made of an insulating sheet having a vertical section substantially shaped like an inverted letter U and a plating solution retaining member of a net or porous sheet which is supported by the supporting member to drape over the outer surfaces thereof. The supporting member is bored with plural holes for supplying plating solution which are arranged discretely in the longitudinal direction at the positions corresponding to the plating areas or close thereto. The plating solution is constantly supplied to the plating solution retaining member via the plural holes to seep thereon. The plating areas are electro-plated at minute portions thereof by contacting with the plating solution which is seeped out of the retaining member.

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Patent Owner(s)

Patent OwnerAddress
ELECTROPLATING ENGINEERS OF JAPAN LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Murata, Yasuto Kanagawa, JP 6 54
Tezuka, Junichi Kanagawa, JP 81 433
Yamamoto, Kenji Tokyo, JP 747 7580

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