Method of manufacturing an electronic identification card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 20, 1987
Grant Date -
N/A
app pub date -
Apr 3, 1986
filing date -
Apr 12, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The method and arrangement according to the invention utilize an adhesive tape (1) covered with a protective layer (2) provided with openings (4). This tape is glued on a film (5) carrying contact metallizations (8) and integrated circuit chips (6) electrically connected to the said metallizations. The tape is glued on the film in such a manner that its openings (4) correspond to the positions of the integrated circuit chips (6). Subsequently, a coating varnish is applied by pulverization to the film and then the protective layer is removed with the varnish covering it. Vignettes slightly larger than the said openings are then cut in the film in such a manner that an adhesive ring is left around the integrated circuit chips. Each vignette is finally arranged in a recess ad hoc (12) of a card (10).
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