Electrolytic apparatus and process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 18, 1987
Grant Date -
N/A
app pub date -
Feb 3, 1986
filing date -
Feb 3, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifold assembly adapted to be immersed in the electrolyte and positioned adjacent to each of the anodes immersed therein for withdrawing electrolyte past the anode to provide a controlled rate of flow across the anode surface to achieve a substantially uniform mass transport rate across the fluid film on the surface of the anode. The apparatus is also adapted for returning at least a portion of the withdrawn electrolyte to the tank which can be arranged so as to impinge upon the article being plated.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully