Apparatus for fuse-bonding articles
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United States of America Patent
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-
Jul 14, 1987
Grant Date -
N/A
app pub date -
Sep 16, 1986
filing date -
Sep 17, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A vapor phase bonding apparatus wherein articles to be bonded are heated with hot vapors of a heat transfer liquid so that a bonding agent such as a solder provided between the articles to be bonded is melted to effect the bonding. The apparatus includes a vessel for containing the heat transfer liquid, a heater for vaporizing the heat transfer liquid, inlet and outlet port means provided in the vessel to allow the passage of articles to be bonded therethrough, conveying means to convey the articles through the inside of the vessel via inlet and outlet port means, closure means for opening and closing the inlet and outlet port means, and cooling means provided on the closure means for condensing vapors of the heat transfer liquid.
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