Process for the manufacture of a corrugated wafer board panel
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United States of America Patent
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Jun 23, 1987
Issued Date -
N/A
app pub date -
Jun 23, 1986
filing date -
Aug 15, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A platen assembly is provided having a working surface which can be mechanically converted between planar and corrugated configurations. A mat of wood wafers coated with thermosetting resin binder is deposited between upper and lower, spaced apart platen assemblies of this type. The platen assemblies, in the planar configuration, are then pressed together to a limited extent to pre-compress the mat to fix the wafers. Horizontal force is then applied to the platen assemblies to convert them to the corrugated configuration, with the pre-compressed mat retained therebetween. The mat is therefore forced to adopt a corrugated form. The platen assemblies are then further pressed together and heated, to cure the resin and produce a corrugated wafer board panel.
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