Method of making a mounting base pad for semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 19, 1987
Grant Date -
N/A
app pub date -
Jun 27, 1984
filing date -
Jun 27, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad and flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully