Method of forming highly sensitive photoresist film in the absence of water

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United States of America Patent

PATENT NO 4663269
SERIAL NO

06763371

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Abstract

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Method of forming highly sensitive, high resolution positive photoresist compositions that are developed from polycarbonates derived from t-diols and various diphenols and homopolycarbonates from t-diols, mixed with 2-10% of onium salts wtih complex metal halide counterions. The high sensitivity of the photoresist compositions is due to the thermodynamic stabilities of the resulting incipient dicarbocations and dienes.

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Patent OwnerAddress
POLYTECHNIC INSTITUTE OF NEW YORK 333 JAY STREET BROOKLYN NEW YORK 111201 A CORP OF N YNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Attarwala, Shabbir Jackson Heights, NY 63 687
Narang, Subhash C Menlo Park, CA 28 1021

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