Method and apparatus for unloading electronic circuit packages from zero insertion force sockets
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United States of America Patent
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Apr 28, 1987
Grant Date -
N/A
app pub date -
Dec 16, 1985
filing date -
Dec 16, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed are methods and apparatus for rapidly and automatically unloading electronic circuit packages from zero insertion force sockets on a burn-in board or the like by inverting the burn-in board and placing sequential rows of the sockets in compressive rolling contact with a roller supported beneath the burn-in board. Means are provided to capture the electronic circuit packages as they fall from the sockets and to store the packages in carrier tubes.
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