Method of electrically interconnecting a laminated printed circuit by use of a compressed, solder-plated connector pin
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United States of America Patent
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Feb 24, 1987
Issued Date -
N/A
app pub date -
Jul 29, 1985
filing date -
Feb 22, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for electrically interconnecting a laminated printed circuit structure comprises the steps of inserting a solder-plated connecting conductor pin into a through hole bored through overlying interconnecting sections of the respective printed circuit sheets, applying pressure to both ends of the pin to compress and thicken the pin, and passing an electric current through the pin to solder the pin and the respective interconnecting sections to one another at the inner peripheral surface of the through hole.
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