Mold release enhancement for acrylonitrile-butadiene-styrene molding resins
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United States of America Patent
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Jan 27, 1987
Grant Date -
N/A
app pub date -
Mar 25, 1986
filing date -
Mar 25, 1986
priority date (Note) -
Expired
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Abstract
Thermoplastic molding compositions are provided which include acrylonitrile-butadiene-styrene resin in combination with a mold release agent ester that is a wax ester including cetyl palmitate, cetyl stearate and blends of cetyl palmitate and cetyl stearate. Also provided is a method for reducing the release force needed to remove injection molded acrylonitrile-butadiene-styrene parts from the mold by incorporating the mold release agent ester into the thermoplastic molding composition.
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