Surface treatment process
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United States of America Patent
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-
Jan 6, 1987
Grant Date -
N/A
app pub date -
Jun 19, 1985
filing date -
Jun 29, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A substrate is treated for forming a thin film on the surface of the substrate to obtain a hard layer adhering to the substrate surface. For this purpose the substrate is placed in a metal vapor atmosphere and simultaneously bombarded by metal or nonmetal ions which are implanted into the substrate while the metal vapor atmosphere is also being ionized.
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