Multilayer series-connected coil assembly on a wafer and method of manufacture
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United States of America Patent
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-
Dec 2, 1986
Grant Date -
N/A
app pub date -
Mar 5, 1986
filing date -
Mar 5, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A coil assembly has flat spiral conductive coils on an insulative slab. The coils are respectively covered by alternate insulative layers having open areas exposing inner ends of the coils to which conductive jumpers are connected. Outer ends of the coils are connected to other conductive pads on the slab. The coils are connected in series via the jumpers.
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