Diamond saw

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United States of America Patent

PATENT NO 4624237
SERIAL NO

06706875

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Abstract

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A diamond saw for cutting hard materials, in which a steel plate is fixed with a sintered abrading body consisting of diamond abrasive granules and a bonding metal powder, characterized in that a plurality of grooves are provided on the surface of both the front and back side faces of the sintered abrading body.

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Patent Owner(s)

Patent OwnerAddress
SANKYO DIAMOND INDUSTRIAL CO LTD A CORP OF JAPAN1770 HONGO EBINA-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Jiro 6-5 303, Kami Tsuruma 5-chome, Sagamihara-shi, Kanagawa, JP 113 1497

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