Method of manufacturing a Group II-VI semiconductor device having a PN junction

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United States of America Patent

PATENT NO 4619718
SERIAL NO

06628974

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Abstract

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A method of manufacturing a semiconductor device by the use of a Group II-VI compound semiconductor crystal prepared by liquid growth method using a temperature difference technique under controlled vapor pressure of the crystal-constituting Group VI element. Thus, the concentration of vacancies and other defects acting as donor is reduced as compared with the concentration of the p type impurity to be introduced. This invention is suitable for producing light-emitting diodes emitting a light of short-wave lengths.

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Patent OwnerAddress
SCM METAL PRODUCTS INC WESTERN RESERVE BUILDING 1468 WEST 9TH STREET CLEVELAND OHIO 44113 A CORP OF DENot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishizawa, Jun-ichi No. 6-16, Komegafukuro 1-chome, Sendai-shi, Miyagi-ken, JP 152 3265

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