Formaldehyde-free autocatalytic electroless copper plating
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United States of America Patent
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Oct 14, 1986
Grant Date -
N/A
app pub date -
Dec 17, 1985
filing date -
Dec 21, 1984
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Expired
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Abstract
Copper may be deposited non-electrolytically from a composition comprising copper ions, a complexor to keep the copper ions in solution, and glyoxylate ions as a reducing agent. The use of formaldehyde is therefore avoided.
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