Gold alloy plating bath and process
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United States of America Patent
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Oct 7, 1986
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N/A
app pub date -
Jan 31, 1985
filing date -
Jan 31, 1985
priority date (Note) -
Expired
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Abstract
A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.
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