Filler for electronic element encapsulation resin and electronic element encapsulation resin composition containing the same
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United States of America Patent
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Oct 7, 1986
Grant Date -
N/A
app pub date -
Nov 8, 1984
filing date -
Nov 30, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
According to the invention, a filler for an electronic element encapsulation resin composition is provided. The filler comprises 5 to 95 parts by weight of fused silica beads of generally spherical form and 95 to 5 parts by weight of crushed particles of fused silica of rugged form. The resin composition admixed with the filler has excellent fluidity without the formation of burs when molded.
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