Wire bonding apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4603803
SERIAL NO

06718936

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Abstract

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A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that bonds can be quickly and effectively made upon devices located on an X-Y movement table.

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Patent Owner(s)

Patent OwnerAddress
ASM ASSEMBLY AUTOMATION LTD20/F WATSON CENTRE 16-22 KUNG YIP STREET KWAI CHUNG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Lo Kwan Hong Kong, HK 2 68
Li, Wai Sau Hong Kong, HK 1 49

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  • 49 Citation Count
  • B23K Class
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  • 39 Age
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