Bonding tool and clamp assembly and wire handling method
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United States of America Patent
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-
Jul 15, 1986
Grant Date -
N/A
app pub date -
Jul 25, 1984
filing date -
Jul 25, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bonding tool and clamp assembly is disclosed and includes an upper wire guide (23,51) and a bonding tool (17,75) having a short guide hole (45) adjacent the heel of the bonding tool foot (41). The bonding tool tip (17a) includes a clamping surface (47) adjacent the guide hole (45); and a clamp (21b,49b) is selectively forced toward the clamping surface (47) to clamp the bonding wire (39,77). The clamp (21b,49b) is biased toward the clamping surface by a spring (37,73), and is released from the clamping surface by an electromagnet (29,57).
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