Polyamideimide resin composition
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United States of America Patent
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Jul 8, 1986
Grant Date -
N/A
app pub date -
Nov 2, 1984
filing date -
Apr 28, 1984
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Expired
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Abstract
A polyamideimide resin composition is proposed which includes a polyamideimide resin, a polyetherimide resin and a fluororesin. The composition not only maintains high mechanical strength and electrical insulation of polyamideimide resin, but also has high thermal shock temperature even in a wet state, high antistick quality and melt-processability.
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