Apparatus for feeding wire to a wire bonding mechanism
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United States of America Patent
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-
Feb 25, 1986
Grant Date -
N/A
app pub date -
Sep 19, 1983
filing date -
Sep 19, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for supplying wire to a wire bonding mechanism is presented. Lengths of wire are fed to a low mass wire-loop reservoir while the bonding process is taking place. Wire is then supplied, at a high speed, from the wire-loop reservoir for the next bonding operation. The amount of wire supplied is precisely measured by measuring the change in the amount of wire stored in the reservoir. The apparatus can supply both single lead wire and twin lead wire. When twin lead wire is supplied, the two wires of the twin lead are separated at predetermined points before being fed to the wire-loop reservoir.
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