Soldering apparatus
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United States of America Patent
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-
Feb 18, 1986
Grant Date -
N/A
app pub date -
Nov 13, 1984
filing date -
Nov 14, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for automatically coating terminal leads of electrical components such as IC with solder for improving solderability thereof. A plurality of IC stored in a row within a container placed at a predetermined feed location are automatically fed onto a track extending adjacent to a series of work stations arranged in a straight path and including a soldering station in which IC are contacted with a solder wave. Driving means is provided for displacing along the track the row of IC fed thereon. The worked IC are automatically collected within an empty container placed at a predetermined receipt location.
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