Permanent mandrel for making bumped tapes and methods of forming
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 14, 1986
Grant Date -
N/A
app pub date -
Nov 28, 1984
filing date -
Nov 28, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Reusable mandrels for fabricating bumped circuit base sheets may be formed by alternative methods. One method involves the selective etching of a copper sheet to develop pits or cavities at predetermined locations. A thin plating layer is deposited on the base sheet, covering the surface including the depressions to form the mandrel. After passivation of the plated surface, copper is plated thereon to form the sheet with the bumps in place. This sheet is then peeled off the mandrel so that the mandrel may be reused for making subsequent bumped sheets. An alternative method of forming the reusable mandrel involves the selected build-up of a base metal sheet by plating with a compatible material about islands of photoresist. Thereafter, the photoresist is removed, leaving cavities where the islands had been. This surface is then plated with a thin layer of nickel to form the permanent mandrel.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully