Method for improving the density, strength and bonding of coatings
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United States of America Patent
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Dec 31, 1985
Grant Date -
N/A
app pub date -
Nov 30, 1983
filing date -
Nov 30, 1983
priority date (Note) -
Expired
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Abstract
The method of the present invention improves the density, strength and bonding of coatings which have previously been applied to substrates by prior art methods such as chemical deposition, electrochemical processed, thermal deposition, and mechanical coating. The method of the present invention subjects the coated substrate to a thermal mechanical process in the form of a compressive stress which is applied to the coating at a temperature greater than about 0.5 T.sub.i and less than T.sub.i where T.sub.i is the incipient melting temperature. The compressive stress is preferably applied through a pressure transfer medium and should be greater in magnitude than about 30 ksi. The dwell time under maximum compressive stress can be from about 0.1 second to about 10 seconds depending on the temperature of the coating, the substrate and the magnitude of the compressive stress.
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