Method for inspecting crimp bonded terminals
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United States of America Patent
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-
Nov 26, 1985
Grant Date -
N/A
app pub date -
Oct 24, 1983
filing date -
Oct 24, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In an improved method for inspecting crimp bonded terminals, instead of inspecting visually, contour images of crimp bonded terminals are picked up and scanned to provide necessary data and processing operations are performed on the data to make a decision automatically on the acceptance or rejection of the crimp bonded terminals, thereby elevating the inspection efficiency and improving the accuracy of deciding the acceptance or rejection of the crimp bonded terminals.
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