High speed copper electroplating process and bath therefor
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United States of America Patent
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Nov 26, 1985
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N/A
app pub date -
May 29, 1984
filing date -
May 29, 1984
priority date (Note) -
Expired
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Abstract
An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities substantially higher than heretofore feasible. The electrolyte contains an additive system comprising carefully controlled relative concentrations of: (a) a bath soluble polyether compound; (b) a bath soluble organic divalent sulfur compound; (c) a bath soluble adduct of a tertiary alkyl amine with epichlorohydrin; and (d) a bath soluble reaction product of polyethyleneimine and an alkylating agent.
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