Four-motion wire bonder
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United States of America Patent
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Nov 5, 1985
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N/A
app pub date -
Aug 24, 1982
filing date -
Aug 24, 1982
priority date (Note) -
Expired
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Abstract
A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z-and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.
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