Process for metallization of dielectric substrate through holes
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United States of America Patent
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Oct 1, 1985
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N/A
app pub date -
Apr 26, 1984
filing date -
Apr 26, 1984
priority date (Note) -
Expired
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Abstract
A method of metallizing through holes in dielectric substrates with a metallizing material comprising forming a hole in the substrate utilizing laser techniques, depositing a layer of a dielectric on the side wall of the hole and then depositing a layer of a metallizing material onto the dielectric layer.
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