Hollow microspheres with organosilicon-silicate walls
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United States of America Patent
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Sep 10, 1985
Issued Date -
N/A
app pub date -
Feb 27, 1984
filing date -
Apr 8, 1982
priority date (Note) -
Expired
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Abstract
Hollow microspheres of reduced surface energy and reactivity and of improved packing and sphericity are prepared by simultaneously forming said microspheres and reacting them with an organosilicon compound. The microspheres are prepared by spray drying a solution of alkali metal silicate and a 'polysalt.' The organosilicon is present as the microspheres are formed, penetrates and reacts to form a shell consisting of a silicate, polysalt and the organosilicon compound. The resulting product is more discrete, more free-flowing, has better packaging characteristics, improved packing factor and improved filler properties when compared to prior-art microspheres.
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