Phenol formaldehyde resoles for making phenolic foam
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United States of America Patent
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Sep 3, 1985
Issued Date -
N/A
app pub date -
Jul 27, 1984
filing date -
Jul 9, 1982
priority date (Note) -
Expired
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Abstract
The present invention is directed to aqueous phenol formaldehyde resoles that have particular application in manufacturing phenolic foam insulation. The resoles are essentially phenol formaldehyde condensation polymers having molar ratios of formaldehyde to phenol of from about 1.7:1 to 2.3:1, preferably from 1.75:1 to 2.25:1 and most preferably about 2:1. The resoles have a weight average molecular weight greater than 800 and preferably from 950-1500. The resoles also have a number average molecular weight greater than 350 and preferably from about 400 to about 600 and a dispersivity greater than about 1.7, preferably from 1.8 to 2.6. Phenol formaldehyde resoles having these characteristics are processable into phenolic foams having a low k value and having other physical characteristics which make the phenolic foam especially useful as an insulation material. The present invention is also directed to foamable phenolic resole compositions prepared from the phenolic resoles and phenolic foams prepared from the compositions.
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