Epoxy resin composition

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United States of America Patent

PATENT NO 4532308
SERIAL NO

06633925

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Abstract

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1. An epoxy resin composition is described, comprising (1) a mixture of epoxides of Components (A), (B) and (C) Component (A): 20 to 60 wt % of an epoxy compound having a spiroacetal ring represented by the formula: ##STR1## Component (B): 10 to 50 wt % of a brominated epoxy resin Component (C): 10 to 50 wt % of an epoxy resin selected from the group consisting of diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, novolac type epoxy resins and N,N,O-triglycidyl-aminophenol type epoxy resins, and (2) a hardening agent.

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Patent Owner(s)

Patent OwnerAddress
TORAY INDUSTRIES INCTOKYO
MITSUBISHI YUKA FINE CHEMICALS CO LTDTOKYO
MITSUBISHI PETROLEUM CO LTD5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kanayama, Kaoru Ibaraki, JP 12 93
Sato, Tadahide Shiga, JP 1 11
Sugimoto, Tosio Mie, JP 1 11
Tobukuro, Kuniaki Shiga, JP 10 146

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