Soldering apparatus
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United States of America Patent
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-
Jul 23, 1985
Issued Date -
N/A
app pub date -
Dec 16, 1983
filing date -
Dec 16, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered by contact with a progressive wave of a molten solder progressing in a direction transverse to the path of travel of the printed circuit board. A nozzle member provided with an array of molten solder overflowing ports arranged in a direction transverse to the travelling path is moveable in the same direction so as to form the progressive wave of molten solder.
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