Inner lead bonder
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United States of America Patent
Stats
-
Jul 2, 1985
Grant Date -
N/A
app pub date -
Dec 5, 1983
filing date -
Mar 3, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An inner lead bonder for bonding dies to leads of carrier tape with improved positional accuracy and improved work efficiency. In the inner lead bonder, dies are fed to a die positioning spot one at a time and positioned. Then, said positioned die is carried to a bonding position. On the other hand, leads of a carrier tape are fed to the bonding position and positioned at the spot above the aforesaid die. Thereafter, the leads of the carrier tape are pressed onto the die and bonded by using a bonding tool. This inner lead bonder is characterized in that it includes a rotary table with the size covering the die positioning point and the bonding position, and after positioning the die on the rotary table, the rotary table is rotated in order to bring the die positioned as mentioned above to the bonding position to place the die at a proper position for bonding.
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