Solder wave apparatus and method
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United States of America Patent
Stats
-
Jul 2, 1985
Grant Date -
N/A
app pub date -
Mar 22, 1983
filing date -
Mar 22, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved solder wave apparatus and method that minimizes the undesirable phenomenon of solder splash is presented. A V-shaped trough is placed across the top of the inner container or box of an otherwise conventional solder wave machine. The V-shaped trough is positioned so that the bottom thereof is lower than the lowest side wall or walls of the inner container. A hole in the bottom at a first end of the trough allows molten solder to enter therein. A dam is placed along the length of the trough and divides the trough into the first and second sections. The dam includes a hole at the bottom to allow molten solder to pass from the first section into the second section. A slot or opening placed in the side wall of the inner container above a second end of the trough allows the molten solder to fall back into an outer container of the solder wave machine, from which location the solder is pumped back into the inner container in conventional fashion. Articles to be tinned with the molten solder are dipped thereinto in the second section of the trough, the undesirable solder splash phenomenon having already occurred, if at all, while the molten solder was held in the first section of the trough.
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