Technique of producing tapered features in integrated circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 30, 1985
Grant Date -
N/A
app pub date -
Nov 18, 1982
filing date -
Nov 18, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A technique is presented for producing tapered walls. In accordance with the disclosed technique, a mask is generated on a workpiece and the workpiece is etched through the mask to replicate the mask pattern into the mask. These steps result in walls at the boundaries of the replicated mask features. In many such processes, these walls are either substantially vertical or have an overhanging portion of the walls. In order to taper the walls, the upper corners of the walls are cut away to remove the overhang or to cut the corner back an additional amount to produce a controlled amount of taper.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully