Process for producing printed circuit boards
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United States of America Patent
Stats
-
Apr 23, 1985
Grant Date -
N/A
app pub date -
Apr 6, 1984
filing date -
Apr 7, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention provides a process for producing a printed circuit board characterized by the steps of drilling holes in a copper clad laminate, treating the entire surface of the laminate including the hole-defining inner surfaces with a catalyst, removing the catalyst from the surface of the copper foil of the laminate by mechanically cleaning the surface of the copper foil, depositing electroless nickel only on the hole-defining inner surfaces, forming a pattern with an etching resist, etching away the copper foil except at the pattern area, removing the etching resist, masking with a solder resist the entire surface except at the hole-defining inner surfaces and the lands, and subjecting the hole-defining inner surfaces and the lands to electroless copper plating.
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