Heat pipe manifold system
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United States of America Patent
Stats
-
Feb 19, 1985
Grant Date -
N/A
app pub date -
Jul 6, 1983
filing date -
Jul 6, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A hot manifold system for use in the injection molding of plastics is disclosed wherein runner channel heating is accomplished by heat pipes disposed within the manifold adjacent to the runner channels contained therein. The manifold system is an elongated structure having a heat receiving portion and a runner containing portion such that heat input may be applied to the heat receiving portion at an accessible location relative to the mold and conveyed to the remainder of the manifold for uniform heating thereof by the heat pipes.
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