High reliability electrical components
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United States of America Patent
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-
Dec 4, 1984
Grant Date -
N/A
app pub date -
Feb 16, 1982
filing date -
Feb 16, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An array of electrically interconnected spaced electrical components on an apertured substrate wafer, each component being connected to terminal conductor pads on one surface of the substrate and to terminal conductor pads on the opposite surface of the substrate by thick film conductor strips which extend along the walls of the apertures is disclosed.
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