Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 30, 1984
Grant Date -
N/A
app pub date -
Jul 26, 1983
filing date -
Jul 26, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for aligning the leads of an integrated circuit (IC) package with respect to the pads of the printed circuit board to which they will be bonded is presented. An alignment fixture, comprising a coarse alignment pedestal mounted on a fine alignment block, receives the IC package on the alignment fixture and aligns the leads with respect to a reference coordinate system of the alignment fixture. A vacuum chuck is lowered to contact the aligned package, and is then raised to lift the aligned package off the fine alignment block while holding it in the aligned position. An X-Y table positions the printed circuit board under the aligned package. The vacuum chuck lowers the aligned package until the leads contact the pads, and holds it while the leads are bonded to the pads.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully