Electroplating film-forming metals in non-aqueous electrolyte
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United States of America Patent
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Aug 14, 1984
Grant Date -
N/A
app pub date -
Feb 16, 1983
filing date -
Feb 18, 1982
priority date (Note) -
Expired
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Abstract
Metals such as lead, silver, copper, calcium, antimony, cadmium, nickel and zinc are electroplated onto a film-forming metal substrate from the group of aluminium, titanium, zirconium, niobium, molybdenum, tungsten, tantalum and alloys thereof, using an etching/electroplating solution comprising ions of the metal(s) to be plated, optionally alkali metal ions, aluminium halide and an aromatic hydrocarbon. Surface oxide is removed from the film-forming metal substrate by reaction with the aluminium halide and the metal(s) in solution to form soluble complexes, this possibly being assisted by anodization. This is followed by cathodically connecting the substrate and passing current to electroplate the metal(s) onto the oxide-free surface, directly in the same etching/electroplating solution.
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