Modified epoxy resin composition
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United States of America Patent
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Jul 31, 1984
Grant Date -
N/A
app pub date -
Dec 22, 1981
filing date -
Oct 6, 1981
priority date (Note) -
Expired
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Abstract
Modified epoxy resin compositions having excellent flexibility and excellent compatibility with conventional epoxy resins as well as exhibiting the original properties of the epoxy resin before being modified such as mechanical strength, adhesion, heat resistance are disclosed and chemical resistance, which are obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100. The modified adduct is obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] containing one primary amino group in the molecule and a compound [C] containing a hydroxy group in the molecule.
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