Epoxy resin adhesive compositions

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4447579
SERIAL NO

06370090

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a room temperature curable epoxy resin adhesive composition having excellent T-peel strength, comprising an epoxy resin containing more than one epoxy group in a molecule on an average, and a hardener in the form of a polyamide-amine, which is obtained from reaction of polyamine with diene rubber having carboxyl terminal groups and other compound having carboxyl groups.

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Patent Owner(s)

Patent OwnerAddress
TOHTO KASEI CO LTDTOKYO 103
CEMEDINE CO LT5-9 HIGASHIGOTANDA 4-CHOME SHINAGAWA-KU A CORP OF JAPAN TOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Horibe, Michiharu Kamagaya, JP 1 20
Takagi, Yasuo Chiba, JP 71 1013

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