Wire bonding apparatus
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United States of America Patent
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Apr 24, 1984
Issued Date -
N/A
app pub date -
May 11, 1982
filing date -
May 4, 1981
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for high speed bonding of fine wires to electrodes includes a method of teaching the wire bonding tool the exact point of engagement of the bonding tool with the semiconductor. The bonding position point of engagement is employed to calculate a tolerance inflection point representative of the point in space where the bonding tool must start a constant velocity approach to the first bonding position. In similar manner, the point of engagement of the bonding tool with the semiconductor is determined and from that position a reset point is calculated representative of point in space where the bonding tool will start its rapid decelleration approach to the tolerance inflection point. The bonding tool may then be acceleration toward the bonding position with optimum speed without crashing into the semiconductor.
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