Method for producing high temperature electrical connection
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United States of America Patent
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-
Dec 27, 1983
Issued Date -
N/A
app pub date -
Sep 30, 1982
filing date -
Aug 31, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Improved lead attachment method accommodates a situation wherein electrical signal leads must be connected to portions of a circuit operating at high temperatures such as 900.degree. F. or more and terminate in equipment operating at or near ambient temperatures. For example, in solid electrolyte oxygen sensors incorporating a tubular ceramic member, a connection wire which is sufficiently thick to resist wire breakage during normal handling has been found to be too thick to bond to a connection pad on the ceramic without having the bond crack during thermal cycling. With improved method, a thin wire is attached to a thicker one in a region where flexing cannot occur. At least the larger wire is shrunk-fit into a hole formed in the ceramic before firing, and then the thinner wire is bonded to the pad with a conductive paste which must also be fired.
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