Semiconductor wafer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4410580
SERIAL NO

06094562

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor wafer is provided having a plurality of projections along the dicing lines of the wafer surrounding each area on which an integrated circuit is formed, the projections being spaced apart.

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Patent Owner(s)

  • TOKYO SHIBAURA ELECTRIC CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okutsu, Kinnosuke Oita, JP 1 5

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