Method of manufacturing cement bonded boards
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United States of America Patent
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-
Sep 6, 1983
Grant Date -
N/A
app pub date -
Dec 14, 1981
filing date -
Dec 22, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Cement bonded boards are manufactured by mixing wooden chip material with cement, additives and water and forming this mixture into a mat from which individual sections corresponding to the desired length of the board blanks are then produced. The individual sections are pressed and then hardened by the application of heat which produces initial setting of the cement. The boards are then left for a period of time so that the cement bond can reach its full strength. After this stage the boards are passed through a conditioning channel to achieve a moisture balance between the atmosphere and the board material. Only at this stage are the boards subjected to an edge preparation process in which they are trimmed to the final size. The waste material is at least partly comminuted and return to the beginning of the process where it is once again added to the chip material prior to the mat forming step.
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